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IC Sockets

Photo	Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	10-71250-10 CONN SOCKET SIP 10POS TIN Aries Electronics	4,899	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7350-10 CONN SOCKET SIP 10POS TIN Aries Electronics	2,306	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7400-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,831	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7410-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,239	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7450-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,701	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7475-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,791	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7500-10 CONN SOCKET SIP 10POS TIN Aries Electronics	2,850	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7550-10 CONN SOCKET SIP 10POS TIN Aries Electronics	1,881	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7560-10 CONN SOCKET SIP 10POS TIN Aries Electronics	3,852	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	10-7600-10 CONN SOCKET SIP 10POS TIN Aries Electronics	4,620	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	10 (1 x 10)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C

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