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IC Sockets

Photo	Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
	20-7590-10 CONN SOCKET SIP 20POS TIN Aries Electronics	4,173	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7650-10 CONN SOCKET SIP 20POS TIN Aries Electronics	4,479	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7670-10 CONN SOCKET SIP 20POS TIN Aries Electronics	4,877	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7700-10 CONN SOCKET SIP 20POS TIN Aries Electronics	1,950	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7712-10 CONN SOCKET SIP 20POS TIN Aries Electronics	2,119	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7750-10 CONN SOCKET SIP 20POS TIN Aries Electronics	3,747	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7770-10 CONN SOCKET SIP 20POS TIN Aries Electronics	3,377	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7780-10 CONN SOCKET SIP 20POS TIN Aries Electronics	4,643	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7810-10 CONN SOCKET SIP 20POS TIN Aries Electronics	4,085	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C
	20-7820-10 CONN SOCKET SIP 20POS TIN Aries Electronics	1,498	-	RFQ	Datasheet	700 Elevator Strip-Line™	Bulk	Active	SIP	20 (1 x 20)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled	-55°C ~ 105°C

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