IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-636-41-007101

116-83-636-41-007101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,458
RFQ
116-83-636-41-007101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-143-15-081101

510-87-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip

1,664
RFQ
510-87-143-15-081101

Datasheet

510 Bulk Active PGA 143 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-011101

116-83-628-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,744
RFQ
116-83-628-41-011101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-640-41-001101

122-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,404
RFQ
122-87-640-41-001101

Datasheet

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
217-83-764-41-005101

217-83-764-41-005101

DIL SOLDER TAIL 1.778MM

Preci-Dip

3,947
RFQ

-

217 - Active - - - - - - - - - - - - - - -
146-83-636-41-035101

146-83-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

1,695
RFQ
146-83-636-41-035101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-636-41-036101

146-83-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,636
RFQ
146-83-636-41-036101

Datasheet

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-144-15-001101

510-87-144-15-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

1,556
RFQ
510-87-144-15-001101

Datasheet

510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-144-15-081101

510-87-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip

1,075
RFQ
510-87-144-15-081101

Datasheet

510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-133-13-041101

510-87-133-13-041101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

3,708
RFQ
510-87-133-13-041101

Datasheet

510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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