IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-600M35-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,632 |
|
Datasheet |
558 | Bulk | Active | BGA | 600 (35 x 35) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-600M35-001105CONN SOCKET PGA 600POS GOLD Preci-Dip |
3,140 |
|
Datasheet |
518 | Bulk | Active | PGA | 600 (35 x 35) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-600M35-001106CONN SOCKET PGA 600POS GOLD Preci-Dip |
4,868 |
|
Datasheet |
518 | Bulk | Active | PGA | 600 (35 x 35) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-652M35-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,925 |
|
Datasheet |
558 | Bulk | Active | PGA | 652 (35 x 35) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-361-18-101135PGA SOLDER TAIL Preci-Dip |
1,391 |
|
Datasheet |
550 | Bulk | Active | PGA | 361 (18 x 18) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-652M35-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
4,659 |
|
Datasheet |
558 | Bulk | Active | BGA | 652 (35 x 35) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-652M35-001105CONN SOCKET PGA 652POS GOLD Preci-Dip |
4,088 |
|
Datasheet |
518 | Bulk | Active | PGA | 652 (35 x 35) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-652M35-001106CONN SOCKET PGA 652POS GOLD Preci-Dip |
2,859 |
|
Datasheet |
518 | Bulk | Active | PGA | 652 (35 x 35) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
