IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-87-312-11-001101

299-87-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,568
RFQ
299-87-312-11-001101

Datasheet

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-640-41-001151

110-87-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

192
RFQ
110-87-640-41-001151

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-87-310-41-134191

114-87-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,944
RFQ
114-87-310-41-134191

Datasheet

114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-10-003101

110-83-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,664
RFQ
110-83-316-10-003101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-314-41-006101

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,396
RFQ
116-83-314-41-006101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-320-41-001101

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

237
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-624-41-001101

110-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,016
RFQ
110-83-624-41-001101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-316-41-001101

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,058
RFQ
123-83-316-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-320-41-001101

123-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,098
RFQ
123-83-320-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-41-801101

110-83-316-41-801101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

480
RFQ
110-83-316-41-801101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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