IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-87-304-41-012101

116-87-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,395
RFQ
116-87-304-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-304-41-001101

614-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,842
RFQ
614-83-304-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-308-41-605101

110-87-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,826
RFQ
110-87-308-41-605101

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-304-41-105101

110-83-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

1,117
RFQ
110-83-304-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-304-41-007101

116-87-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

3,303
RFQ
116-87-304-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-304-41-001101

612-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

4,106
RFQ
612-83-304-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-306-41-001101

614-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,162
RFQ
614-87-306-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-306-41-105101

110-87-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,283
RFQ
110-87-306-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-306-41-001101

612-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

1,201
RFQ
612-87-306-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-304-41-002101

116-87-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

4,442
RFQ
116-87-304-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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