IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-3518-112

24-3518-112

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,930
RFQ
24-3518-112

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-6518-112

24-6518-112

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,850
RFQ
24-6518-112

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-6810-90T

12-6810-90T

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

2,092
RFQ
12-6810-90T

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
09-71000-10

09-71000-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,869
RFQ
09-71000-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7325-10

09-7325-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,538
RFQ
09-7325-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7350-10

09-7350-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,082
RFQ
09-7350-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7375-10

09-7375-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,797
RFQ
09-7375-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7380-10

09-7380-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,741
RFQ
09-7380-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7420-10

09-7420-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,312
RFQ
09-7420-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-7450-10

09-7450-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,338
RFQ
09-7450-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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