IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-83-210-10-001101

299-83-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,847
RFQ
299-83-210-10-001101

Datasheet

299 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-324-41-105161

110-83-324-41-105161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,659
RFQ
110-83-324-41-105161

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-324-41-003101

116-83-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,842
RFQ
116-83-324-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-428-41-012101

116-87-428-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,554
RFQ
116-87-428-41-012101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-632-41-003101

116-87-632-41-003101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,245
RFQ
116-87-632-41-003101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-420-41-007101

116-83-420-41-007101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,565
RFQ
116-83-420-41-007101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-068-10-001101

510-87-068-10-001101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,091
RFQ
510-87-068-10-001101

Datasheet

510 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-068-10-061101

510-87-068-10-061101

CONN SOCKET PGA 68POS GOLD

Preci-Dip

4,758
RFQ
510-87-068-10-061101

Datasheet

510 Bulk Active PGA 68 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-328-41-001101

614-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,518
RFQ
614-83-328-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-428-41-001101

614-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,316
RFQ
614-83-428-41-001101

Datasheet

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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