IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-318-41-011101

116-83-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,660
RFQ
116-83-318-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-87-610-10-002101

299-87-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,012
RFQ
299-87-610-10-002101

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-328-41-007101

116-87-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,154
RFQ
116-87-328-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-628-41-001101

612-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,379
RFQ
612-83-628-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-624-41-001101

122-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,112
RFQ
122-83-624-41-001101

Datasheet

122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-624-41-001101

123-83-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,125
RFQ
123-83-624-41-001101

Datasheet

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-003101

116-83-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,264
RFQ
116-83-628-41-003101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-324-41-012101

116-83-324-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,084
RFQ
116-83-324-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-420-41-011101

116-87-420-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,023
RFQ
116-87-420-41-011101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-324-41-007101

116-83-324-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,711
RFQ
116-83-324-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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