IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
123-83-628-41-001101

123-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,461
RFQ
123-83-628-41-001101

Datasheet

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-432-41-009101

116-87-432-41-009101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,022
RFQ
116-87-432-41-009101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-624-41-009101

116-83-624-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,117
RFQ
116-83-624-41-009101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-448-41-005101

117-83-448-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,518
RFQ
117-83-448-41-005101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-432-41-001101

612-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,159
RFQ
612-83-432-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-107-12-051101

510-87-107-12-051101

CONN SOCKET PGA 107POS GOLD

Preci-Dip

4,269
RFQ
510-87-107-12-051101

Datasheet

510 Bulk Active PGA 107 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-648-41-005101

117-83-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,867
RFQ
117-83-648-41-005101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-328-41-007101

116-83-328-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,659
RFQ
116-83-328-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-652-41-001101

110-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,355
RFQ
110-83-652-41-001101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-430-41-105101

117-83-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

3,734
RFQ
117-83-430-41-105101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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