IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
115-83-950-41-001101

115-83-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,994
RFQ

-

115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-432-41-001101

122-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,090
RFQ
122-83-432-41-001101

Datasheet

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-432-41-001101

123-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,441
RFQ
123-83-432-41-001101

Datasheet

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-640-41-001101

612-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3,937
RFQ
612-83-640-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-069-11-001101

510-83-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

2,931
RFQ
510-83-069-11-001101

Datasheet

510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-648-41-003101

115-83-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,642
RFQ
115-83-648-41-003101

Datasheet

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-632-41-801101

110-83-632-41-801101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,865
RFQ
110-83-632-41-801101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-652-41-005101

110-83-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,332
RFQ
110-83-652-41-005101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-636-41-001101

612-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,066
RFQ
612-83-636-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-642-41-001101

614-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,344
RFQ
614-83-642-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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