IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
299-87-616-10-002101

299-87-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,467
RFQ
299-87-616-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-632-41-002101

116-83-632-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,943
RFQ
116-83-632-41-002101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-950-31-012101

614-87-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

1,369
RFQ
614-87-950-31-012101

Datasheet

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-428-41-009101

116-83-428-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,610
RFQ
116-83-428-41-009101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-642-31-012101

614-83-642-31-012101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,442
RFQ
614-83-642-31-012101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-001101

116-83-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,914
RFQ
116-83-628-41-001101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-132-14-001101

510-87-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

3,805
RFQ
510-87-132-14-001101

Datasheet

510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-132-14-071101

510-87-132-14-071101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

1,285
RFQ
510-87-132-14-071101

Datasheet

510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-636-41-001101

121-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

1,351
RFQ
121-83-636-41-001101

Datasheet

121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-648-41-001101

614-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,104
RFQ
614-83-648-41-001101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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