IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
146-87-306-41-036101

146-87-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,361
RFQ
146-87-306-41-036101

Datasheet

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-005101

110-83-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

1,736
RFQ
110-83-308-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-308-41-605101

110-83-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

4,596
RFQ
110-83-308-41-605101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-306-41-006101

116-83-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

4,772
RFQ
116-83-306-41-006101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-314-10-001101

110-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

1,073
RFQ
110-87-314-10-001101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-306-41-105161

110-83-306-41-105161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,030
RFQ
110-83-306-41-105161

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-306-31-012101

614-83-306-31-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,003
RFQ
614-83-306-31-012101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-308-41-003101

115-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,923
RFQ
115-83-308-41-003101

Datasheet

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-210-41-105101

110-87-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,609
RFQ
110-87-210-41-105101

Datasheet

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-310-41-001101

614-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,276
RFQ
614-87-310-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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