IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
612-83-964-41-001101

612-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

1,175
RFQ
612-83-964-41-001101

Datasheet

612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-328-41-013101

116-87-328-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,622
RFQ
116-87-328-41-013101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-428-41-013101

116-87-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,624
RFQ
116-87-428-41-013101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-632-41-004101

116-83-632-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,405
RFQ
116-83-632-41-004101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-648-41-007101

116-83-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

4,764
RFQ
116-83-648-41-007101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-642-41-011101

116-83-642-41-011101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

4,761
RFQ
116-83-642-41-011101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-622-10-002101

299-83-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,106
RFQ
299-83-622-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-121-11-000101

510-83-121-11-000101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

1,661
RFQ
510-83-121-11-000101

Datasheet

510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-191-18-091101

510-87-191-18-091101

CONN SOCKET PGA 191POS GOLD

Preci-Dip

4,805
RFQ
510-87-191-18-091101

Datasheet

510 Bulk Active PGA 191 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-664-41-105101

117-83-664-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

1,446
RFQ
117-83-664-41-105101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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