IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
117-87-316-41-005101

117-87-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,539
RFQ
117-87-316-41-005101

Datasheet

117 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-310-41-117101

114-83-310-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,911
RFQ
114-83-310-41-117101

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-310-41-134161

114-83-310-41-134161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,039
RFQ
114-83-310-41-134161

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-310-41-003101

116-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,579
RFQ
116-87-310-41-003101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-210-41-001101

614-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

4,317
RFQ
614-87-210-41-001101

Datasheet

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-312-41-105101

110-87-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2,296
RFQ
110-87-312-41-105101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-610-31-012101

614-87-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,055
RFQ
614-87-610-31-012101

Datasheet

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-007101

116-87-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,671
RFQ
116-87-308-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-10-001101

110-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

2,455
RFQ
110-83-314-10-001101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-210-41-005101

110-83-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,261
RFQ
110-83-210-41-005101

Datasheet

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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