IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
517-83-364-17-091111CONN SOCKET PGA 364POS GOLD Preci-Dip |
4,787 |
|
Datasheet |
517 | Bulk | Active | PGA | 364 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-168-17-101112CONN SOCKET PGA 168POS GOLD Preci-Dip |
1,049 |
|
Datasheet |
614 | Bulk | Active | PGA | 168 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-83-365-17-091111CONN SOCKET PGA 365POS GOLD Preci-Dip |
1,239 |
|
Datasheet |
517 | Bulk | Active | PGA | 365 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-255M16-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
1,450 |
|
Datasheet |
550 | Bulk | Active | BGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-256M16-000166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,810 |
|
Datasheet |
550 | Bulk | Active | BGA | 256 (16 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-256M20-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
4,458 |
|
Datasheet |
550 | Bulk | Active | BGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-419-19-001154CONN SOCKET PGA 419POS GOLD Preci-Dip |
4,491 |
|
Datasheet |
514 | Bulk | Active | PGA | 419 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-83-192M16-001148CONN SOCKET BGA 192POS GOLD Preci-Dip |
2,353 |
|
Datasheet |
514 | Bulk | Active | BGA | 192 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-83-223-18-091117CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,414 |
|
Datasheet |
514 | Bulk | Active | PGA | 223 (18 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-175-16-072112CONN SOCKET PGA 175POS GOLD Preci-Dip |
1,496 |
|
Datasheet |
614 | Bulk | Active | PGA | 175 (16 x 16) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
