IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
517-83-419-19-111111CONN SOCKET PGA 419POS GOLD Preci-Dip |
2,666 |
|
Datasheet |
517 | Bulk | Active | PGA | 419 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-87-292M20-001148CONN SOCKET BGA 292POS GOLD Preci-Dip |
2,735 |
|
Datasheet |
514 | Bulk | Active | BGA | 292 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-325-18-111147CONN SOCKET PGA 325POS GOLD Preci-Dip |
4,927 |
|
Datasheet |
546 | Bulk | Active | PGA | 325 (18 x 18) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-87-685-19-000111CONN SOCKET PGA 685POS GOLD Preci-Dip |
1,614 |
|
Datasheet |
517 | Bulk | Active | PGA | 685 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-83-428-19-101111CONN SOCKET PGA 428POS GOLD Preci-Dip |
4,447 |
|
Datasheet |
517 | Bulk | Active | PGA | 428 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-83-429-19-101111CONN SOCKET PGA 429POS GOLD Preci-Dip |
2,462 |
|
Datasheet |
517 | Bulk | Active | PGA | 429 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-192M16-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
4,937 |
|
Datasheet |
558 | Bulk | Active | BGA | 192 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-80-296-19-131135PGA SOLDER TAIL Preci-Dip |
2,390 |
|
Datasheet |
550 | Bulk | Active | PGA | 296 (19 x 19) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-192M16-001105CONN SOCKET PGA 192POS GOLD Preci-Dip |
1,233 |
|
Datasheet |
518 | Bulk | Active | PGA | 192 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-192M16-001106CONN SOCKET PGA 192POS GOLD Preci-Dip |
2,353 |
|
Datasheet |
518 | Bulk | Active | PGA | 192 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
