IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-480M29-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,050 |
|
Datasheet |
558 | Bulk | Active | BGA | 480 (29 x 29) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-576M30-001148CONN SOCKET BGA 576POS GOLD Preci-Dip |
4,130 |
|
Datasheet |
514 | Bulk | Active | BGA | 576 (30 x 30) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-480M29-001105CONN SOCKET PGA 480POS GOLD Preci-Dip |
3,081 |
|
Datasheet |
518 | Bulk | Active | PGA | 480 (29 x 29) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-478M26-131106CONN SOCKET PGA 478POS GOLD Preci-Dip |
3,576 |
|
Datasheet |
518 | Bulk | Active | PGA | 478 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-520M31-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
1,134 |
|
Datasheet |
558 | Bulk | Active | PGA | 520 (31 x 31) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-480M29-001106CONN SOCKET PGA 480POS GOLD Preci-Dip |
1,305 |
|
Datasheet |
518 | Bulk | Active | PGA | 480 (29 x 29) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-560M33-001152BGA SOLDER TAIL Preci-Dip |
2,285 |
|
Datasheet |
550 | Bulk | Active | BGA | 560 (33 x 33) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-500M30-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,131 |
|
Datasheet |
558 | Bulk | Active | BGA | 500 (30 x 30) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-600M35-001148CONN SOCKET BGA 600POS GOLD Preci-Dip |
1,640 |
|
Datasheet |
514 | Bulk | Active | BGA | 600 (35 x 35) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-500M30-001105CONN SOCKET PGA 500POS GOLD Preci-Dip |
4,804 |
|
Datasheet |
518 | Bulk | Active | PGA | 500 (30 x 30) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
