IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-210-41-012101

116-83-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,066
RFQ
116-83-210-41-012101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-040-11-061101

510-87-040-11-061101

CONN SOCKET PGA 40POS GOLD

Preci-Dip

2,663
RFQ
510-87-040-11-061101

Datasheet

510 Bulk Active PGA 40 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-210-41-018101

116-83-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,119
RFQ
116-83-210-41-018101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-314-41-001101

612-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,671
RFQ
612-83-314-41-001101

Datasheet

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-001101

116-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,538
RFQ
116-87-312-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-314-41-001101

122-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

4,403
RFQ
122-87-314-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-430-41-005101

117-87-430-41-005101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

4,008
RFQ
117-87-430-41-005101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-312-41-001101

123-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,835
RFQ
123-83-312-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-320-41-005101

110-83-320-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,150
RFQ
110-83-320-41-005101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-320-41-605101

110-83-320-41-605101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,244
RFQ
110-83-320-41-605101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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