IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-210-41-007101

116-83-210-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,432
RFQ
116-83-210-41-007101

Datasheet

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-316-41-006101

116-83-316-41-006101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

4,166
RFQ
116-83-316-41-006101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-328-01-777101

110-83-328-01-777101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,537
RFQ
110-83-328-01-777101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-420-41-001101

612-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,186
RFQ
612-87-420-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-324-41-001101

110-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,155
RFQ
110-83-324-41-001101

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-324-41-001151

110-83-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,004
RFQ

-

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-628-41-001101

110-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,555
RFQ
110-87-628-41-001101

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-318-41-012101

116-87-318-41-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,149
RFQ
116-87-318-41-012101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-610-41-008101

116-83-610-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,471
RFQ
116-83-610-41-008101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-316-41-001101

614-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

1,856
RFQ
614-83-316-41-001101

Datasheet

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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