IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-83-320-41-002101

116-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

1,609
RFQ
116-83-320-41-002101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-424-41-001101

612-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,402
RFQ
612-83-424-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-324-41-134191

114-83-324-41-134191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,984
RFQ
114-83-324-41-134191

Datasheet

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-432-41-105101

117-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

4,095
RFQ
117-87-432-41-105101

Datasheet

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-83-322-41-001101

122-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,049
RFQ
122-83-322-41-001101

Datasheet

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
123-83-322-41-001101

123-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

1,957
RFQ
123-83-322-41-001101

Datasheet

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-608-10-002101

299-83-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,639
RFQ
299-83-608-10-002101

Datasheet

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-424-41-003101

116-83-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,564
RFQ
116-83-424-41-003101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-011101

116-87-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,914
RFQ
116-87-320-41-011101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-648-41-003101

115-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

1,931
RFQ
115-87-648-41-003101

Datasheet

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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