IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
116-87-428-41-007101

116-87-428-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,382
RFQ
116-87-428-41-007101

Datasheet

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-624-41-105101

117-83-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

4,652
RFQ
117-83-624-41-105101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-081-12-071101

510-87-081-12-071101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

4,100
RFQ
510-87-081-12-071101

Datasheet

510 Bulk Active PGA 81 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-636-41-018101

116-87-636-41-018101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

4,540
RFQ
116-87-636-41-018101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-312-41-013101

116-87-312-41-013101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

4,371
RFQ
116-87-312-41-013101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-328-41-105161

110-83-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

1,207
RFQ
110-83-328-41-105161

Datasheet

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-624-41-009101

116-87-624-41-009101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,044
RFQ
116-87-624-41-009101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-422-41-001101

121-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,597
RFQ
121-83-422-41-001101

Datasheet

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-650-41-003101

115-87-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

1,482
RFQ
115-87-650-41-003101

Datasheet

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-318-41-001101

116-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,790
RFQ
116-83-318-41-001101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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