IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
510-83-049-07-000101

510-83-049-07-000101

CONN SOCKET PGA 49POS GOLD

Preci-Dip

4,407
RFQ
510-83-049-07-000101

Datasheet

510 Bulk Active PGA 49 (7 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-83-428-41-001101

612-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,124
RFQ
612-83-428-41-001101

Datasheet

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-628-41-105161

110-83-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,612
RFQ
110-83-628-41-105161

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-642-41-105101

110-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,690
RFQ
110-87-642-41-105101

Datasheet

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-656-41-005101

117-87-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

3,616
RFQ
117-87-656-41-005101

Datasheet

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
121-83-420-41-001101

121-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

4,320
RFQ
121-83-420-41-001101

Datasheet

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-318-41-004101

116-87-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

4,524
RFQ
116-87-318-41-004101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-006101

116-83-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

4,658
RFQ
116-83-628-41-006101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

4,722
RFQ
612-87-640-41-001101

Datasheet

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-322-41-007101

116-83-322-41-007101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

4,633
RFQ
116-83-322-41-007101

Datasheet

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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