IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-478M26-131148CONN SOCKET BGA 478POS GOLD Preci-Dip |
3,706 |
|
Datasheet |
514 | Bulk | Active | BGA | 478 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-400M20-000104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,819 |
|
Datasheet |
558 | Bulk | Active | BGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-480M29-001148CONN SOCKET BGA 480POS GOLD Preci-Dip |
4,441 |
|
Datasheet |
514 | Bulk | Active | BGA | 480 (29 x 29) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-400M20-000105CONN SOCKET PGA 400POS GOLD Preci-Dip |
3,267 |
|
Datasheet |
518 | Bulk | Active | PGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-652M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,469 |
|
Datasheet |
550 | Bulk | Active | BGA | 652 (35 x 35) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-456M26-001152BGA SOLDER TAIL Preci-Dip |
3,612 |
|
Datasheet |
550 | Bulk | Active | BGA | 456 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-528-21-121147CONN SOCKET PGA 528POS GOLD Preci-Dip |
3,250 |
|
Datasheet |
546 | Bulk | Active | PGA | 528 (21 x 21) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-432M31-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,414 |
|
Datasheet |
558 | Bulk | Active | PGA | 432 (31 x 31) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-529-21-121147CONN SOCKET PGA 529POS GOLD Preci-Dip |
2,354 |
|
Datasheet |
546 | Bulk | Active | PGA | 529 (21 x 21) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-400M20-000106CONN SOCKET PGA 400POS GOLD Preci-Dip |
3,506 |
|
Datasheet |
518 | Bulk | Active | PGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
