IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-456M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,607 |
|
Datasheet |
558 | Bulk | Active | PGA | 456 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-420M26-001106CONN SOCKET PGA 420POS GOLD Preci-Dip |
4,310 |
|
Datasheet |
518 | Bulk | Active | PGA | 420 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-432M31-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,706 |
|
Datasheet |
558 | Bulk | Active | BGA | 432 (31 x 31) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-559-22-131147CONN SOCKET PGA 559POS GOLD Preci-Dip |
4,802 |
|
Datasheet |
546 | Bulk | Active | PGA | 559 (22 x 22) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-432M31-001105CONN SOCKET PGA 432POS GOLD Preci-Dip |
3,406 |
|
Datasheet |
518 | Bulk | Active | PGA | 432 (31 x 31) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-520M31-001148CONN SOCKET BGA 520POS GOLD Preci-Dip |
1,916 |
|
Datasheet |
514 | Bulk | Active | BGA | 520 (31 x 31) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-432M31-001106CONN SOCKET PGA 432POS GOLD Preci-Dip |
4,158 |
|
Datasheet |
518 | Bulk | Active | PGA | 432 (31 x 31) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-500M30-001152BGA SOLDER TAIL Preci-Dip |
2,128 |
|
Datasheet |
550 | Bulk | Active | BGA | 500 (30 x 30) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-504M29-001152BGA SOLDER TAIL Preci-Dip |
2,962 |
|
Datasheet |
550 | Bulk | Active | BGA | 504 (29 x 29) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-478M26-131101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,126 |
|
Datasheet |
558 | Bulk | Active | PGA | 478 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
