IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
546-87-420-19-111147CONN SOCKET PGA 420POS GOLD Preci-Dip |
2,882 |
|
Datasheet |
546 | Bulk | Active | PGA | 420 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-400M20-000166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,801 |
|
Datasheet |
550 | Bulk | Active | BGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
517-83-565-21-111111CONN SOCKET PGA 565POS GOLD Preci-Dip |
1,507 |
|
Datasheet |
517 | Bulk | Active | PGA | 565 (21 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-83-559-22-131111CONN SOCKET PGA 559POS GOLD Preci-Dip |
1,390 |
|
Datasheet |
517 | Bulk | Active | PGA | 559 (22 x 22) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
517-83-599-54-131111CONN SOCKET PGA 599POS GOLD Preci-Dip |
1,986 |
|
Datasheet |
517 | Bulk | Active | PGA | 599 (54 x 54) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-87-388M26-001148CONN SOCKET BGA 388POS GOLD Preci-Dip |
2,520 |
|
Datasheet |
514 | Bulk | Active | BGA | 388 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-279-19-081112CONN SOCKET PGA 279POS GOLD Preci-Dip |
2,273 |
|
Datasheet |
614 | Bulk | Active | PGA | 279 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-83-320-19-131147CONN SOCKET PGA 320POS GOLD Preci-Dip |
2,804 |
|
Datasheet |
546 | Bulk | Active | PGA | 320 (19 x 19) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-281-19-001112CONN SOCKET PGA 281POS GOLD Preci-Dip |
2,201 |
|
Datasheet |
614 | Bulk | Active | PGA | 281 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-83-321-19-121147CONN SOCKET PGA 321POS GOLD Preci-Dip |
1,602 |
|
Datasheet |
546 | Bulk | Active | PGA | 321 (19 x 19) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
