IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-272M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,217 |
|
Datasheet |
558 | Bulk | Active | BGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-272M20-001105CONN SOCKET PGA 272POS GOLD Preci-Dip |
4,936 |
|
Datasheet |
518 | Bulk | Active | PGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-292M20-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
1,453 |
|
Datasheet |
558 | Bulk | Active | PGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-364-17-091147CONN SOCKET PGA 364POS GOLD Preci-Dip |
3,433 |
|
Datasheet |
546 | Bulk | Active | PGA | 364 (17 x 17) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-272M20-001106CONN SOCKET PGA 272POS GOLD Preci-Dip |
4,652 |
|
Datasheet |
518 | Bulk | Active | PGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-365-14-000147CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,782 |
|
Datasheet |
546 | Bulk | Active | PGA | 365 (14 x 14) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-83-365-17-091147CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,955 |
|
Datasheet |
546 | Bulk | Active | PGA | 365 (17 x 17) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-87-432M31-001148CONN SOCKET BGA 432POS GOLD Preci-Dip |
1,431 |
|
Datasheet |
514 | Bulk | Active | BGA | 432 (31 x 31) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-87-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
3,785 |
|
Datasheet |
614 | Bulk | Active | PGA | 320 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-87-321-19-121144CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,792 |
|
Datasheet |
614 | Bulk | Active | PGA | 321 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
