IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-255M16-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
4,559 |
|
Datasheet |
558 | Bulk | Active | BGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-256M16-000104BGA SURFACE MOUNT 1.27MM Preci-Dip |
4,990 |
|
Datasheet |
558 | Bulk | Active | BGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-256M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,273 |
|
Datasheet |
558 | Bulk | Active | BGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-255M16-001105CONN SOCKET PGA 255POS GOLD Preci-Dip |
3,396 |
|
Datasheet |
518 | Bulk | Active | PGA | 255 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-272M20-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
1,160 |
|
Datasheet |
558 | Bulk | Active | PGA | 272 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-80-381-18-101135PGA SOLDER TAIL Preci-Dip |
2,613 |
|
Datasheet |
550 | Bulk | Active | PGA | 381 (18 x 18) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-256M16-000105CONN SOCKET PGA 256POS GOLD Preci-Dip |
2,093 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-256M20-001105CONN SOCKET PGA 256POS GOLD Preci-Dip |
3,704 |
|
Datasheet |
518 | Bulk | Active | PGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD Preci-Dip |
3,245 |
|
Datasheet |
514 | Bulk | Active | BGA | 400 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-292M20-001152BGA SOLDER TAIL Preci-Dip |
4,112 |
|
Datasheet |
550 | Bulk | Active | BGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
