IC Sockets

Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
550-10-420M26-001166

550-10-420M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3,170
RFQ
550-10-420M26-001166

Datasheet

550 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
614-87-296-19-131144

614-87-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

3,167
RFQ
614-87-296-19-131144

Datasheet

614 Bulk Active PGA 296 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-447-20-121147

546-87-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip

3,428
RFQ
546-87-447-20-121147

Datasheet

546 Bulk Active PGA 447 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-255M16-001106

518-77-255M16-001106

CONN SOCKET PGA 255POS GOLD

Preci-Dip

2,642
RFQ
518-77-255M16-001106

Datasheet

518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-256M16-000106

518-77-256M16-000106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

4,763
RFQ
518-77-256M16-000106

Datasheet

518 Bulk Active PGA 256 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-256M20-001106

518-77-256M20-001106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

4,689
RFQ
518-77-256M20-001106

Datasheet

518 Bulk Active PGA 256 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-432M31-001166

550-10-432M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

4,278
RFQ
550-10-432M31-001166

Datasheet

550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-87-463-19-101147

546-87-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

1,042
RFQ
546-87-463-19-101147

Datasheet

546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-299-20-001112

614-83-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3,284
RFQ
614-83-299-20-001112

Datasheet

614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-87-420M26-001148

514-87-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip

2,620
RFQ
514-87-420M26-001148

Datasheet

514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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