IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-456M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
1,608 |
|
Datasheet |
550 | Bulk | Active | BGA | 456 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
614-87-325-18-111144CONN SOCKET PGA 325POS GOLD Preci-Dip |
3,095 |
|
Datasheet |
614 | Bulk | Active | PGA | 325 (18 x 18) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-296-19-131147CONN SOCKET PGA 296POS GOLD Preci-Dip |
4,913 |
|
Datasheet |
546 | Bulk | Active | PGA | 296 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-83-391-18-101147CONN SOCKET PGA 391POS GOLD Preci-Dip |
2,281 |
|
Datasheet |
546 | Bulk | Active | PGA | 391 (18 x 18) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-292M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
1,583 |
|
Datasheet |
558 | Bulk | Active | BGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-292M20-001105CONN SOCKET PGA 292POS GOLD Preci-Dip |
3,004 |
|
Datasheet |
518 | Bulk | Active | PGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
517-83-685-19-000111CONN SOCKET PGA 685POS GOLD Preci-Dip |
1,660 |
|
Datasheet |
517 | Bulk | Active | PGA | 685 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-83-352M26-001148CONN SOCKET BGA 352POS GOLD Preci-Dip |
2,289 |
|
Datasheet |
514 | Bulk | Active | BGA | 352 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-87-456M26-001148CONN SOCKET BGA 456POS GOLD Preci-Dip |
1,467 |
|
Datasheet |
514 | Bulk | Active | BGA | 456 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-478M26-131166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,938 |
|
Datasheet |
550 | Bulk | Active | BGA | 478 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
