IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
518-77-352M26-001106CONN SOCKET PGA 352POS GOLD Preci-Dip |
3,618 |
|
Datasheet |
518 | Bulk | Active | PGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-432M31-001148CONN SOCKET BGA 432POS GOLD Preci-Dip |
2,731 |
|
Datasheet |
514 | Bulk | Active | BGA | 432 (31 x 31) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-360M19-001105CONN SOCKET PGA 360POS GOLD Preci-Dip |
3,105 |
|
Datasheet |
518 | Bulk | Active | PGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-560M33-001148CONN SOCKET BGA 560POS GOLD Preci-Dip |
2,332 |
|
Datasheet |
514 | Bulk | Active | BGA | 560 (33 x 33) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-356M26-001106CONN SOCKET PGA 356POS GOLD Preci-Dip |
2,725 |
|
Datasheet |
518 | Bulk | Active | PGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-357M19-001106CONN SOCKET PGA 357POS GOLD Preci-Dip |
2,954 |
|
Datasheet |
518 | Bulk | Active | PGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-388M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,287 |
|
Datasheet |
558 | Bulk | Active | PGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-360M19-001106CONN SOCKET PGA 360POS GOLD Preci-Dip |
4,309 |
|
Datasheet |
518 | Bulk | Active | PGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-600M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
1,845 |
|
Datasheet |
550 | Bulk | Active | BGA | 600 (35 x 35) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-576M30-001148CONN SOCKET BGA 576POS GOLD Preci-Dip |
2,260 |
|
Datasheet |
514 | Bulk | Active | BGA | 576 (30 x 30) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
