IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-420M26-001152BGA SOLDER TAIL Preci-Dip |
4,059 |
|
Datasheet |
550 | Bulk | Active | BGA | 420 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-400M20-000101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,693 |
|
Datasheet |
558 | Bulk | Active | PGA | 400 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-456M26-001148CONN SOCKET BGA 456POS GOLD Preci-Dip |
4,367 |
|
Datasheet |
514 | Bulk | Active | BGA | 456 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-432M31-001152BGA SOLDER TAIL Preci-Dip |
4,295 |
|
Datasheet |
550 | Bulk | Active | BGA | 432 (31 x 31) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
558-10-388M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,716 |
|
Datasheet |
558 | Bulk | Active | BGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-600M35-001148CONN SOCKET BGA 600POS GOLD Preci-Dip |
4,867 |
|
Datasheet |
514 | Bulk | Active | BGA | 600 (35 x 35) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-388M26-001105CONN SOCKET PGA 388POS GOLD Preci-Dip |
4,189 |
|
Datasheet |
518 | Bulk | Active | PGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-503-22-131147CONN SOCKET PGA 503POS GOLD Preci-Dip |
4,234 |
|
Datasheet |
546 | Bulk | Active | PGA | 503 (22 x 22) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-420M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
4,594 |
|
Datasheet |
558 | Bulk | Active | PGA | 420 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
518-77-388M26-001106CONN SOCKET PGA 388POS GOLD Preci-Dip |
4,903 |
|
Datasheet |
518 | Bulk | Active | PGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
