IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-296-19-131135PGA SOLDER TAIL Preci-Dip |
1,890 |
|
Datasheet |
550 | Bulk | Active | PGA | 296 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-504M29-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
1,535 |
|
Datasheet |
550 | Bulk | Active | BGA | 504 (29 x 29) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-352M26-001152BGA SOLDER TAIL Preci-Dip |
1,064 |
|
Datasheet |
550 | Bulk | Active | BGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-403-19-111147CONN SOCKET PGA 403POS GOLD Preci-Dip |
2,076 |
|
Datasheet |
546 | Bulk | Active | PGA | 403 (19 x 19) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-356M26-001152BGA SOLDER TAIL Preci-Dip |
2,190 |
|
Datasheet |
550 | Bulk | Active | BGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-87-528-21-121147CONN SOCKET PGA 528POS GOLD Preci-Dip |
3,721 |
|
Datasheet |
546 | Bulk | Active | PGA | 528 (21 x 21) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-357M19-001152BGA SOLDER TAIL Preci-Dip |
3,034 |
|
Datasheet |
550 | Bulk | Active | BGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-87-545-17-000147CONN SOCKET PGA 545POS GOLD Preci-Dip |
3,010 |
|
Datasheet |
546 | Bulk | Active | PGA | 545 (17 x 17) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-360M19-001152BGA SOLDER TAIL Preci-Dip |
4,019 |
|
Datasheet |
550 | Bulk | Active | BGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
550-10-520M31-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,087 |
|
Datasheet |
550 | Bulk | Active | BGA | 520 (31 x 31) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
