IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-87-520M31-001148CONN SOCKET BGA 520POS GOLD Preci-Dip |
1,633 |
|
Datasheet |
514 | Bulk | Active | BGA | 520 (31 x 31) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-360M19-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,207 |
|
Datasheet |
558 | Bulk | Active | PGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
614-83-325-18-111144CONN SOCKET PGA 325POS GOLD Preci-Dip |
4,228 |
|
Datasheet |
614 | Bulk | Active | PGA | 325 (18 x 18) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-388M26-001152BGA SOLDER TAIL Preci-Dip |
3,432 |
|
Datasheet |
550 | Bulk | Active | BGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
546-83-447-20-121147CONN SOCKET PGA 447POS GOLD Preci-Dip |
3,490 |
|
Datasheet |
546 | Bulk | Active | PGA | 447 (20 x 20) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-560M33-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,483 |
|
Datasheet |
550 | Bulk | Active | BGA | 560 (33 x 33) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-420M26-001148CONN SOCKET BGA 420POS GOLD Preci-Dip |
4,295 |
|
Datasheet |
514 | Bulk | Active | BGA | 420 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-381-18-101135PGA SOLDER TAIL Preci-Dip |
4,077 |
|
Datasheet |
550 | Bulk | Active | PGA | 381 (18 x 18) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
614-83-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
3,275 |
|
Datasheet |
614 | Bulk | Active | PGA | 320 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
558-10-352M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,871 |
|
Datasheet |
558 | Bulk | Active | BGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
