IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-356M26-001148CONN SOCKET BGA 356POS GOLD Preci-Dip |
3,855 |
|
Datasheet |
514 | Bulk | Active | BGA | 356 (26 x 26) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-480M29-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
4,787 |
|
Datasheet |
550 | Bulk | Active | BGA | 480 (29 x 29) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-357M19-001148CONN SOCKET BGA 357POS GOLD Preci-Dip |
3,371 |
|
Datasheet |
514 | Bulk | Active | BGA | 357 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
518-77-292M20-001106CONN SOCKET PGA 292POS GOLD Preci-Dip |
1,493 |
|
Datasheet |
518 | Bulk | Active | PGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-83-360M19-001148CONN SOCKET BGA 360POS GOLD Preci-Dip |
4,386 |
|
Datasheet |
514 | Bulk | Active | BGA | 360 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-503-22-131147CONN SOCKET PGA 503POS GOLD Preci-Dip |
1,801 |
|
Datasheet |
546 | Bulk | Active | PGA | 503 (22 x 22) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
546-87-529-21-121147CONN SOCKET PGA 529POS GOLD Preci-Dip |
1,365 |
|
Datasheet |
546 | Bulk | Active | PGA | 529 (21 x 21) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
514-87-478M26-131148CONN SOCKET BGA 478POS GOLD Preci-Dip |
4,425 |
|
Datasheet |
514 | Bulk | Active | BGA | 478 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
550-10-500M30-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
1,031 |
|
Datasheet |
550 | Bulk | Active | BGA | 500 (30 x 30) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
|
514-87-480M29-001148CONN SOCKET BGA 480POS GOLD Preci-Dip |
2,880 |
|
Datasheet |
514 | Bulk | Active | BGA | 480 (29 x 29) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
